| 摘要 |
An apparatus in which a pair of hollow molding portions 53 and 54 for molding in which a terminal connecting portion with a terminal fitting 20 crimped onto a conductor 11 at a tip portion of a sheathed wire 10 is accommodated and set are provided inside a mold 50 made up by an upper mold 51 and a lower mold 52, a molding resin 30 in a molten state being injected and poured into the molding portions 53 and 54 to cover and mold the terminal connecting portion so as to provide waterproofing, the terminal connecting portion subjected to covering and molding being released from the mold so as to be removed outside the mold. A casting surface of the molding portion 53 of the upper mold 51 is provided with a gradient or a curvature for facilitating the release of the terminal connecting portion subjected to covering and molding from the mold, whereby the terminal connecting portion subjected to covering and molding remains in the molding portion 54 of the lower mold 52 during mold releasing.
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