LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a light emitting device having good conductivity and the manufacturing method of the same, in the light emitting device having a structure wherein a light emitting layer unit is bonded to an element substrate through a metal layer.

SOLUTION: In the light emitting device 100, the first principal surface of a compound semiconductor layer having a light emitting layer part 24 is utilized as a light take out surface, and the element substrate 7 is connected to the second principal surface side of the compound semiconductor layer through a main metal layer 10 having a reflection surface for reflecting light from the light emitting layer part 24 to the light take out surface side. The element substrate 7 is constituted of an Si substrate having conductivity type of p-type and a contact layer 31 mainly composed of Al is formed immediately above the principal surface of the main metal layer 10 side of the element substrate 7.

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