| 摘要 |
<P>PROBLEM TO BE SOLVED: To overcome the problem wherein the stiffened plate of an IC module reduces stress to a semiconductor device by dispersing an external force in a contactless IC card, but a further reinforcement is required when a larger impact force is applied, and the standard of thickness in the IC card cannot be satisfied by the method only to thicken the stiffened plate. <P>SOLUTION: In the contactless IC card, a semiconductor device 21 is connected on an antenna substrate 24 where an antenna 25 is formed. On the antenna substrate 24, a spacer 30 consisting of an annular metal is composed so as to surround the semiconductor device 21. Further, the stiffened plate 31 consisting of metals for reinforcement is arranged on the upper part of the spacer 30. In such a configuration, the contactless IC card, which is inexpensive and strong in physical strength, is provided. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
