发明名称 STORAGE BOARD FOR STORING CHIP-TYPE ELECTRONIC COMPONENT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a storage board for storing chip-state electronic components capable of preventing or restraining occurrence of vibration when a surface cover tape is peeled off from a base board, and of preventing the chip-state electronic components from being scattered from the board. <P>SOLUTION: The storage board stores chip-state electronic components and is suitable for a high-speed chip-removing process. The storage board comprises the base board (2), with the surface cover tape (3) and a reverse cover tape (6) being thermally bonded in two striped surface areas (7, 8), each having a width of 0.5±0.15mm, on the surface of the base pasteboard, while having a plurality of chip storing transparent holes and delivery holes. The average roughness along the center line of the surface of the base board is 2.5-4.0μm, while the average peel strength (P<SB>ave</SB>) between the base board and the surface cover tape is 0.1-0.6 N, with its peel strength SN ratio [(P<SB>max</SB>-P<SB>min</SB>)/P<SB>ave</SB>] being 0.40 or lower. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p>
申请公布号 JP2004262550(A) 申请公布日期 2004.09.24
申请号 JP20040036630 申请日期 2004.02.13
申请人 OJI PAPER CO LTD 发明人 OKUYA TAKEHITO;YAMAMOTO MANABU;INAGI KANAKO
分类号 B65D73/02;B65D85/86;D21H27/00;H05K13/02;(IPC1-7):B65D73/02 主分类号 B65D73/02
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