| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To realize a reflecting mask that causes no problem in manufacturing a wafer even on a substrate having defects in the external shape. <P>SOLUTION: The reflecting mask is provided with a multilayer that serves as a reflecting region with a non-reflecting region formed thereon and a substrate that carries the multilayer. The non-reflecting and reflecting regions together forms a pattern, and in the area surrounding the regions where the pattern is formed on the substrate the multilayer is not formed. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
