发明名称 |
METHOD FOR MEASURING CONDUCTIVE PARTICLE |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide conductive paste for stably forming a viahole conductor of high quality reduced in variations and realizing a circuit forming substrate having high connection reliability. <P>SOLUTION: A method for measuring conductive particles containing primary particles and flocculated particles thereof includes a process for obtaining the average particle size of primary particles, a process for obtaining the average particle size of flocculated particles and a calculation process using the following formula. The conductive particles contained in the conductive paste are measured numerically by this measuring method. The conductive paste having good flowability and dispersibility can be provided by manufacturing the conductive paste on the basis of this measuring method. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
申请公布号 |
JP2004264031(A) |
申请公布日期 |
2004.09.24 |
申请号 |
JP20030014556 |
申请日期 |
2003.01.23 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
SUGITA YUICHIRO;TAKENAKA TOSHIAKI |
分类号 |
G01N15/02;H01B1/22;H05K1/09;H05K3/46;(IPC1-7):G01N15/02 |
主分类号 |
G01N15/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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