| 摘要 |
PROBLEM TO BE SOLVED: To provide a small and thin Hall element having an electrode shape of a suitable structure when it is surface mounted on a circuit board using solder reflow. SOLUTION: The Hall element comprises a first chip 7, a semiconductor thin film 5 formed in cross-shape on the upper surface 3b thereof, a second chip 3 having electrodes 8a-8d formed to be connected electrically with four end parts of the thin film 5, a recess 11d for containing the chip 7 except an upper surface 7a thereof, and a third chip 11 having electrode terminals 12a-12d formed continuously from an upper surface 11a through a side face 11b to a lower surface 11c. The chip 3 is bonded to the upper surface 7a of the chip 7 contained in a recess 11d of the chip 11 using an insulating adhesive 6 such that it is overlapped with an upper surface 3a of the chip 3, and four electrodes 8a-8d of the chip 3 are connected, respectively, with four electrode terminals 12a-12d of the chip 11 using a conductive member 13. COPYRIGHT: (C)2004,JPO&NCIPI
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