发明名称 |
SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF TO EMBODY LOW DIELECTRIC CONSTANT AND PREVENT PEELING PROBLEM |
摘要 |
PURPOSE: A semiconductor device is provided to remarkably reduce parasitic capacitance of a semiconductor device and control a signal delay caused by miniaturization by supplying an insulation layer capable of embodying a low dielectric constant. CONSTITUTION: An inorganic layer(302) is formed on a semiconductor base material(301). A silicon containing intermediate layer(303) is formed on the inorganic layer. A fluorine containing organic layer(304) is formed on the silicon containing intermediate layer. The inorganic layer is selected from a group composed of a SiO2 layer, a SiC layer, a SiOC layer, a SiCN layer and a SiON layer.
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申请公布号 |
KR20040082295(A) |
申请公布日期 |
2004.09.24 |
申请号 |
KR20040017509 |
申请日期 |
2004.03.16 |
申请人 |
SEMICONDUCTOR LEADING EDGE TECHNOLOGIES INC. |
发明人 |
KAJI NARUHIKO |
分类号 |
H01L21/31;H01L21/312;H01L21/314;H01L21/316;H01L21/768;(IPC1-7):H01L21/31 |
主分类号 |
H01L21/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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