发明名称 SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF TO EMBODY LOW DIELECTRIC CONSTANT AND PREVENT PEELING PROBLEM
摘要 PURPOSE: A semiconductor device is provided to remarkably reduce parasitic capacitance of a semiconductor device and control a signal delay caused by miniaturization by supplying an insulation layer capable of embodying a low dielectric constant. CONSTITUTION: An inorganic layer(302) is formed on a semiconductor base material(301). A silicon containing intermediate layer(303) is formed on the inorganic layer. A fluorine containing organic layer(304) is formed on the silicon containing intermediate layer. The inorganic layer is selected from a group composed of a SiO2 layer, a SiC layer, a SiOC layer, a SiCN layer and a SiON layer.
申请公布号 KR20040082295(A) 申请公布日期 2004.09.24
申请号 KR20040017509 申请日期 2004.03.16
申请人 SEMICONDUCTOR LEADING EDGE TECHNOLOGIES INC. 发明人 KAJI NARUHIKO
分类号 H01L21/31;H01L21/312;H01L21/314;H01L21/316;H01L21/768;(IPC1-7):H01L21/31 主分类号 H01L21/31
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