发明名称 Mechanically scanned wet chemical processing
摘要 A substrate such as a semiconductor wafer is move across the top of an open trough while a liquid is maintained in the trough at a level just above the walls of the trough, as by supplying the liquid to the trough so that the liquid gently overflows the trough. The downwardly-facing surface of the substrate contacts the liquid. The substrate is moved at a constant rate so that the duration of contact is the same for all portions of the surface.
申请公布号 US6794300(B1) 申请公布日期 2004.09.21
申请号 US20020213531 申请日期 2002.08.07
申请人 CREATIVE DESIGN CORP. 发明人 HILLMAN GARY
分类号 H01L21/00;(IPC1-7):H01L21/302 主分类号 H01L21/00
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