| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a micro-type light emitting device which can be applied to designs of light, thin, short and small products. <P>SOLUTION: The micro-type light emitting device comprises a neglect hole provided in a substrate, a light emitting die fastened to the inside of the neglect hole by utilizing light transmitting layers, two electrodes of the light emitting die which are connected electrically by lead wires respectively with first and second power feeding circuits present at the side ends of the substrate, a heat radiating layer provided in the peripheral position uncoated with the light transmitting layers wherethrough a heat is rejected when the action of a pn-junction is so started as to generate the heat of a high temperature, and in addition to these, the foregoing light emitting die fastened to the inside of the neglect hole and not fastened to the surface of the substrate. Thereby, the thickness of the whole of the light emitting device can be reduced, and the effect of a high luminous brightness whom a flip-chip-package art possesses can be obtained simply by a well-known manufacturing method. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
