| 摘要 |
<P>PROBLEM TO BE SOLVED: To quickly detect parts jump for preventing any influence thereof from being exerted on the next process. <P>SOLUTION: A test (a) is executed between a process B for mounting chip parts by a high speed mounter and a process C for mounting variant parts by a variant mounter. In this test (a), not only a mounted parts test for discriminating the mounted condition of chip parts mounted in the previous process but also a parts jump test for discriminating whether or not the chip parts have jumped to a place where variant parts are mounted in the next process C are executed. This parts jump test can be executed under conditions corresponding to the situations of the job site when the failure of the parts is detected in the mounted parts test or when the exchange period of an absorption nozzle approaches in the high speed mounter. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
