发明名称 LIQUID-DROP INJECTION EQUIPMENT, MANUFACTURED PATTERN WIRING BOARD AND DEVICE BOARD
摘要 PROBLEM TO BE SOLVED: To provide a pattern wiring board or a device board having high quality and high accuracy. SOLUTION: In liquid-drop injection equipment 1, a plurality of the liquid drops of a minute-particle containing solution are injected and imparted to a board 14 by an injection head 11, and the volatile component of the liquid drops is volatiled and a pattern wiring or a device is formed. The surface roughness of the pattern forming surface of the board is made rougher than the size of minute particles, and the surface roughness of a board rear is made rougher than the pattern forming surface and brought to the roughness or less of the board holding surface of a liquid-drop injection production device. When the size of the minute particles is represented by Dp and the diameter of a discharge opening by Do, 0.0001≤Dp/Do≤0.01 holds. In the injection head, the liquid drops are injected by working force by a mechanical displacement, and the shape of the drops in the case of the flying of the liquid drops is formed in an approximately round drop immediately before an adhesion on a board surface or columnar shapes being extended in the flying direction and having the lengths of the treble or less of the diameters and the drops are not accompanied by a plurality of fine drops at the rears of flying drops. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004259874(A) 申请公布日期 2004.09.16
申请号 JP20030047711 申请日期 2003.02.25
申请人 RICOH CO LTD 发明人 SEKIYA TAKURO
分类号 B41J2/01;B05D1/26;H01L21/027;H01L21/288;(IPC1-7):H01L21/288 主分类号 B41J2/01
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