发明名称 MECHANICAL DECOUPLING OF A PROBE CARD ASSEMBLY TO IMPROVE THERMAL RESPONSE
摘要 A stiffener structure, a wiring substrate, and a frame having a major surface disposed in a stack can be part of a probe card assembly. The wiring substrate can be disposed between the frame and the stiffener structure, and probe substrates can be coupled to the frame by one or more non-adjustably fixed coupling mechanisms. Each of the probe substrates can have probes that are electrically connected through the probe card assembly to an electrical interface on the wiring substrate to a test controller. The non-adjustably fixed coupling mechanisms can be simultaneously stiff in a first direction perpendicular to the major surface and flexible in a second direction generally parallel to the major surface.
申请公布号 US2010134129(A1) 申请公布日期 2010.06.03
申请号 US20080327643 申请日期 2008.12.03
申请人 FORMFACTOR, INC. 发明人 BREINLINGER KEITH J.;HOBBS ERIC D.
分类号 G01R31/26;G01R1/067;G01R31/02 主分类号 G01R31/26
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