发明名称 MOLDING METHOD AND MOLDING APPARATUS FOR SEMI-SOLID METAL
摘要 PROBLEM TO BE SOLVED: To provide a molding method and a molding apparatus for semi-solid metal, wherein voids and an eutectic, which are generated in a molding formed from semi-solid metal and which are caused by a cold shut at the downstream side of a hole, are reduced. SOLUTION: The molding method is a semi-solid die-casting method wherein a molding is formed by charging and solidifying semi-solid metal (slurry) 1 in a cavity 5. When charging the slurry 1 in the cavity 5, a movable pin 10 forming a hole in the molding is retracted to a retracting position so that the slurry 1 smoothly flows. After the surface layer part 1a of the slurry 1 passes the movable pin 10, the movable pin 10 is advanced to a hole-forming position before charging the slurry 1 is completed. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004255390(A) 申请公布日期 2004.09.16
申请号 JP20030046470 申请日期 2003.02.24
申请人 AISAN IND CO LTD 发明人 YOSHIKAWA NAOTAKA;NAKAI KENJI
分类号 B22D17/00;B22D17/20;B22D17/22;(IPC1-7):B22D17/00 主分类号 B22D17/00
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