| 摘要 |
A multiple IC package module comprises a plurality of IC devices inserted in associated sockets mounted on a substrate. Each IC device has opposed, major surfaces, one of the major surfaces of each device confronting the socket into which the device is inserted. A compressible compliance layer is interposed between the one major surface of each IC device and the associated socket into which the IC device is inserted. The module further comprises a single heat sink having a surface in heat transfer relationship with the other of the major surfaces of the IC devices. Also disclosed is an IC device package comprising an IC device including interconnect pins projecting from the device, a socket comprising contact receptacles for receiving the interconnect pins, and a compressible compliance layer interposed between the IC device and the socket, the interconnect pins projecting through the compliance layer and into the contact receptacles in the socket.
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