| 摘要 |
<P>PROBLEM TO BE SOLVED: To facilitate handling of a FPC (Flexible Printed Circuit board), when the FPC is mounted on an electronic component, while holding it by adhesion. <P>SOLUTION: For mounting an electronic component, a pallet (1) holding the FPC (9) has the periphery part of a first adhesive hold region (21) which is relatively less adhesive and the center part of a second adhesive hold region (22) which is more adhesive than the primary region (21). The pallet (1) has a plurality of through-holes (31), in which projection pins for peeling the FPC (9) are stuck and a plurality of air blast nozzles (32) for assisting the peeling. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
