| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive composition which gives an insulating film having little deformation of a pattern when the composition is thermally cured to form the pattern. <P>SOLUTION: [1] The positive photosensitive composition contains a positive photoresist composition comprising a quinone diazide compound and a novolac resin, a compound which reacts with the novolac resin by the effect of an acid, and a compound which generates an acid by heat. [2] A semiconductor member or a display member is manufactured by applying the positive photosensitive composition described in [1] on a substrate, exposing, developing the exposed part and curing the unexposed part by heat. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
