| 摘要 |
PROBLEM TO BE SOLVED: To provide a reflow preheating drying method which can execute the reflow preheating drying in a short period of time while effectively preventing the occurrence of the droop of cream solder, and its device. SOLUTION: The reflow preheating drying method has: a first preheating process, in which heating to a printed circuit board 1 is executed at a preheating temperature increase speed higher than the maximum value in the droop allowable temperature increase speed range SE being the range of the preheating temperature increase speed capable of suppressing a droop amount of the cream solder 23 and which continues the heating to the temperature ST to generate the droop of the cream solder 23; a second preheating process, in which the printed circuit board 1 after the first preheating process is heated at the preheating temperature increase speed within the droop allowable temperature increase speed range SE and which continues the heating to the temperature ET to stop the progress of the droop of the cream solder 23; and a third preheating process, in which the printed circuit board 1 after the second preheating process is heated at the preheating temperature increase speed higher than the maximum value in the droop allowable temperature increase speed range SE and which continues the heating until it reaches the target temperature. COPYRIGHT: (C)2004,JPO&NCIPI |
