SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, PROCESS FOR FABRICATING SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATING ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device, an electronic device and an electronic apparatus in which damage on a connecting terminal can be prevented when an electrode is bonded, and to provide a process for fabricating a semiconductor device and a process for fabricating the electronic device.

SOLUTION: The connecting terminal 2 is provided with a region 2a wider than a wiring part 2' and a region 2b narrower than the region 2a. While the side end 4a of the electrode 4 is arranged on the region 2a and the side end 4b opposing the side end 4a is arranged on the region 2b, the electrode 4 is bonded onto the connecting terminal 2.

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