| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a ceramic substrate in which an undesired crack along primarily divided groove or secondarily divided groove hardly occurs and which has a high effect of preventing the end face shape fault of a chip-like electronic component. <P>SOLUTION: The ceramic substrate 11 has the depth d<SB>1</SB>of the primarily divided groove 12a formed at a front surface (upper surface A) side which is deeper than the depth d<SB>2</SB>of the primarily divided groove 12b formed at a rear surface (lower surface B) side, and has the depth d<SB>3</SB>of the secondarily divided groove 13a formed on the front surface side which is shallower than the depth d<SB>4</SB>of the secondarily divided groove 13b formed on the rear surface side. When the thickness size between the front surface and the rear surface of the ceramic substrate 11 is t, a value of (d<SB>1</SB>+d<SB>2</SB>) and a value of (d<SB>3</SB>+d<SB>4</SB>) are all set within a range of 0.45t to 0.65t, and are set so as to become (d<SB>1</SB>+d<SB>2</SB>)≥(d<SB>3</SB>+d<SB>4</SB>). <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
