| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer ceramic substrate which has a low resistance value and fine wiring, and in which the drawback of a shape surface such as the disconnection of the wiring or the warping of the substrate does not occur. <P>SOLUTION: For a wiring circuit formed in an outer layer or an inner layer of the multilayer ceramic substrate, there is used metal foil containing a glass particle or a ceramic particle of 1.0 to 55.0vol% of which the tensile strength is 0.5×10<SP>8</SP>to 8.0×10<SP>8</SP>Pa and a mean diameter (D50) is 10μm or less. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
