| 摘要 |
PROBLEM TO BE SOLVED: To improve the resistance to current, and solder heat and reduce the cost of a chip film capacitor. SOLUTION: Capacitor elements around which plastic films are wound so as to be overlapped are arranged in parallel on a thermosetting resin sheet whose width is almost the same, and liquid thermosetting resin whose viscosity rates range from 2 to 7 is packed between those elements, and the same sheet is placed on that, and heating and pressurization processing is carried out so that a band-shaped resin exterior hardened object can be configured. Then, the respective electrode leading parts of the both edge faces are provided with a first external electrode formed of a first metalized contact layer constituted of alloy made of Al 40% to 56%, Si 4% or more and Zn 40%, alloy made of Zn 90% or more and residual Al and alloy made of Cu 60% to 70% and residual Zn or a Zn single substance and a second metalized contact layer constituted of Sn 80% or more and residual Zn and Cu. Also, the second external electrode of a capacitor formed by cutting interelement resins which is joined to the first external electrode of the capacitor is configured as a plate-shaped terminal having a C-shaped, U-shaped, four rectangular or drum-shaped window. COPYRIGHT: (C)2004,JPO&NCIPI
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