| 摘要 |
PROBLEM TO BE SOLVED: To provide a gas barrier polyimide film which has a high-dimensional stability, shows little decrease in peeling strength between the polyimide film and the metal layer even at a high temperature, and is suitable for a substrate for a fine pitch circuit, and to provide its metal laminate. SOLUTION: The gas barrier polyimide film comprises a polyimide film having a modulus of not less than 4GPa, a linear expansion coefficient of 5 to 22ppm/°C at 50-200°C and a heat shrinkage ratio of not more than 0.05% measured for one hour at 200°C and a SiOx layer formed on one side of the polyimide film wherein the gas barrier film has an oxygen permeation ratio of not more than 5.0×10<SP>-15</SP>mol/m<SP>2</SP>×s×Pa. COPYRIGHT: (C)2004,JPO&NCIPI
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