发明名称 Verbindungskonstruktion einer Wärmeleitplatte
摘要 PROBLEM TO BE SOLVED: To provide a support structure for transmitting more heat, by improving the connection strength and temperature uniformity of a heat pipe. SOLUTION: The support structure for flat heat pipes comprises a housing 1; and a support member 2 arranged at the housing 1. The housing 1 has an upper lid 10 and a lower lid 11. The upper and lower lids 10, 11 are engaged each other to form a hollow chamber 12. The hollow chamber 12 is filled with working fluid. The support member 2 has a flat member, having a plurality of punched holes. The support member 2 is sintered along with the upper and lower lids 10, 11 in the hollow chamber 12, and the housing 1 and the support member 2 are integrated. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 DE202004007195(U1) 申请公布日期 2004.09.16
申请号 DE20042007195U 申请日期 2004.05.06
申请人 WANG, CHIN-WEN;WANG, PEI-CHOA;WANG, CHING CHUNG 发明人
分类号 F28D15/02;F28D15/04;H01L23/427;(IPC1-7):G06F1/20;H05K7/20 主分类号 F28D15/02
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