| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photoresist composition which prevents deformation of a resist pattern in a high temperature postbaking process and which decreases the degassing amount during high temperature heating. <P>SOLUTION: The positive photoresist composition comprises (A) an alkali-soluble novolac resin having ≥20,000 mass average molecular weight (Mw) in terms of polystyrene and having ≤4% content of binuclear molecules, (B) a compound containing a phenolic hydroxyl group and having 1,000 Mw, (C) a compound containing a naphthoquinonediazide group and (D) an organic solvent. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
