发明名称 PLASMA TREATMENT APPARATUS, RING MEMBER, AND PLASMA TREATMENT METHOD
摘要 <P>PROBLEM TO BE SOLVED: To share the use of plasma treatment apparatuses when performing a plurality of processes that are different from one another, in the plasma treatment apparatuses that use plasma, and to provide the apparatuses, ring members and a plasma treatment method that can easily align states of plasma between the apparatuses when performing the same processes by using a plurality of the apparatuses. <P>SOLUTION: A substrate to be treated in a treatment container is surrounded by a ring member made of an insulating material. In this ring member, electrodes are provided to adjust a plasma sheath region. When performing a first process on the substrate to be treated, for example, a first direct-current voltage is applied to the electrodes. When performing a second process on the substrate, a second direct-current voltage is applied to the electrodes. This method is applicable to a suitable direct-current voltage for each process or for each of the apparatuses performing the same processes so that the apparatuses have the same plasma conditions, enabling the shared use of the apparatuses and the easy adjustment of the plasma condition. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004260159(A) 申请公布日期 2004.09.16
申请号 JP20040032218 申请日期 2004.02.09
申请人 TOKYO ELECTRON LTD 发明人 SASAKI YASUHARU;MORIYA TAKESHI;NAGAIKE HIROSHI
分类号 H05H1/46;C04B41/80;C04B41/87;C04B41/89;C23C4/10;C23C4/18;C23C28/00;C25D11/04;C25D11/26;C25D11/34;H01L21/304;H01L21/3065 主分类号 H05H1/46
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