| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for transfer molding, having especially excellent long-period storage stability and to provide a sealed semiconductor device sealed by using the same. SOLUTION: The epoxy resin composition comprises (A) an epoxy resin, (B) a phenol resin as a curing agent, (C) an inorganic filler and (D) 3-(3,4-dichlorophenyl)-1,1-dimethylurea as a curing promoter. The sealed semiconductor device is obtained by sealing semiconductor chips with a cured material of the composition. COPYRIGHT: (C)2004,JPO&NCIPI
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