| 摘要 |
PROBLEM TO BE SOLVED: To provide a transparent conductive laminated film which has the merits of an application method to produce a transparent conductive film having a large area at a high speed while suppressing its production costs and surface resistance impossible to attain by the application method alone by using the merits of a sputtering method to form a transparent conductive film low in resistance and excellent in durability and is excellent in adhesion properties. SOLUTION: In the transparent conductive laminated film, a transparent conductive layer is formed on a transparent polymer film substrate with a hard coat layer formed on at least one side through a backing layer of a silicon oxide film formed by applying a sol solution prepared by hydrolyzing an organic silicon compound. In the structure of the conductive layer, a sputter layer of a transparent conductive thin film formed by the sputtering method is laminated on an application layer of a transparent conductive thin film formed by the application method. COPYRIGHT: (C)2004,JPO&NCIPI
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