发明名称 Package for an electrical device
摘要 A package for an electrical device (110) having at least one connection locus for providing selected electrical access to the device includes: (a) a substrate (112) having an accommodation site; (b) at least one electrically conductive mass (114) arranged with the substrate in a neighboring relationship with the accommodation site; (c) at least one connection structure (116) coupling the at least one connection locus with the at least one conductive mass when the device is situated at the accommodation site in an assembled orientation; and (d) an enclosing structure (92) substantially enclosing the device and a portion of the substrate. The enclosing structure and the at least one conductive mass cooperate to present at least one contact structure accessible from exterior of the enclosing structure configured for effecting surface mounting of the package in a circuit. <IMAGE>
申请公布号 EP1298724(A3) 申请公布日期 2004.09.15
申请号 EP20020021963 申请日期 2002.09.30
申请人 TEXAS INSTRUMENTS INCORPORATED 发明人 AKIRA, MATSUNAMI
分类号 H01L23/12;H01L23/053;H01L23/31;H01L23/498;H01L23/52;H05K3/34 主分类号 H01L23/12
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