METHOD FOR APPLYING A RESIN TO A SUBSTRATE FOR USE IN PAPERMAKING

摘要

Often air trapped in a curable resin compromises the integrity of the cured resin structure which effects the durability of the papermaking apparatus. A method is provided to obtain a bubble free curable resin applied to a substrate. The method provides a second material, different from the curable resin, used to fill the interstitial voids of substrate. The method comprises the steps of providing a curable liquid resin, providing a substrate having a first surface and a second surface, the substrate comprising fibers defining voids intermediate the first and second surfaces, and the substrate comprising a second material different from the curable liquid resin, the second material coating at least some of the fibers, wherein the voids adjacent the coated fibers provide fluid communication from the first surface of the substrate to the second surface of the substrate; removing at least some of the second material coating a least some of the fibers; applying the curable liquid resin to the substrate; and curing at least some of the resin to provide a resin layer on the substrate.