Plasma processing apparatus and method

摘要

Disclosed herein is a plasma processing apparatus and a plasma processing method capable of performing plasma processing by performing temperature control of a sample table in accordance with a process step to be performed on a sample. The plasma processing apparatus performs plasma processing on a sample in accordance with a process recipe with the sample being placed on a sample table in which each of a plurality of areas is temperature-controlled by a temperature control means, wherein the process recipe includes a plurality of temperature setting parameters for the sample table, and the plasma processing is performed on the sample in accordance with the process recipe which is prepared for each of a plurality of process steps.