Reinforcement for edge of semiconductor wafer consists of layer of material strong in compression and tension covering one side of edge and engaging pair of keying grooves

摘要

The semiconductor wafer (1) is circular and of uniform thickness (D A). Two circular grooves (6) are formed close together near the edge (2) and concentric with it. The two grooves have the same depth (T G) and width (B G). The centerline of the outer groove is a given distance (A W) from the edge of the wafer. The reinforcement (7) consists of layer of material strong in compression and tension covering one side of the edge. The layer has tapered edges and engages in the pair of keying grooves.