| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package substrate in which the yield after packaging is improved, and to provide a flip chip type semiconductor device. <P>SOLUTION: A package substrate 9 which has a metal of a low thermal expansion as a core while buildup wiring layers are laminated on both surfaces of the metal, and a semiconductor chip 1 are flip-chip-connected. A plurality of through holes and slits are formed in the metal core. Related to a connection terminal, to be connected to a mounting substrate 6, which is formed on a surface of the package substrate 9, a binding force is reduced by the through hole and the slit formed in the metal core despite the difference of coefficient of thermal expansion between the metal core and the mounting substrate 6. On the other hand, difference of the coefficient of thermal expansion between the metal core and the semiconductor chip 1 is small since the metal core has low thermal expansion, so that stresses applied to a flip chip connection bump 3 and a surface of the semiconductor chip 1 are very small, too. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
