| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer grinding device for improving the accuracy of grinding by increasing the support rigidity of an exchange grinding tool and easily installing a working liquid supply nozzle. SOLUTION: The spindle side of the wafer grinding device is constituted mainly of a spindle 1, a fixed grinding tool 2, a tool holder 3, a grinding tool 4, a tool changing arm (ATC) 5 and the working liquid supply nozzle 6. The side of an object to be worked of the wafer grinding device is constituted mainly of a support table 7 and a rotary table 8. The tool holder 3 is constituted of a pull stud 3a, a shank 3b, a flange 3c, and a boss 3d in the order from the spindle side. In this case, the diameter of the flange 3c is formed to be larger than the diameter of the lower end face 1c of the spindle 1 and smaller than the inner diameter of a finishing grind stone 2b. Thus, the lower surface 2e of a finishing grind stone base (base metal part) 2a and the upper surface 3g of the flange 3c can be abutted. COPYRIGHT: (C)2004,JPO&NCIPI
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