| 摘要 |
PROBLEM TO BE SOLVED: To obtain a power semiconductor module and a fixing method of the same capable of reducing a contact heat resistance between a ceramic substrate and a heat radiating plate without causing any crack on the ceramic substrate upon fixing the substrate to the heating plate. SOLUTION: The power semiconductor module 100 comprises a ceramics substrate 1 having a substantially oblong configuration and on which the semiconductor element 5 is mounted, an outer periphery enclosing resin case 7 mounted on the ceramics substrate 1 so as to enclose the mounting region of the semiconductor element 5, and a fixing unit 7c for fixing the ceramics substrate 1 to the heat radiating plate 10. The fixing unit 7c is provided in the outer periphery resin case 7 along respective long sides of the ceramics substrate 1 so as to be positioned at the outer peripheral part of the ceramics substrate 1 so that a sectional area intersecting with the lengthwise direction of respective fixing units 7c is gradually increased from both ends of the lengthwise direction toward the central part of the same direction. COPYRIGHT: (C)2004,JPO&NCIPI |
