| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable wiring board in which a slit hole is precisely formed by positioning it to a wiring pattern of the board and a component such as a semiconductor element can easily be loaded. SOLUTION: In the manufacturing method of the circuit board, the electrode terminal forming face of the semiconductor element is bonded to a face opposite to a face where the wiring patterns 17 of the board are formed, and the electrode terminal of the semiconductor element is wire-bonded with the bonding pad of the wiring pattern through the slit hole 12 formed on the board 10 and they are electrically connected. Copper foil of a copper clad laminate is etched to a prescribed pattern, and the wiring patterns 17 are formed on the board 10. A metal pattern 30 whose position is matched with the wiring patterns 17 and whose position of inner peripheral edge is matched with an extraction line position of the slit hole is formed. The metal pattern 30 is laser-processed as a mask. Thus, the board 10 is fused with an inner peripheral edge position of the metal pattern 30 as the extraction line position, and the slit hole is formed. COPYRIGHT: (C)2004,JPO&NCIPI
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