Interconnect validation instruments

摘要

Interconnect validation instruments and methods are provided. In one embodiment, an interconnect validation instrument has a shell with an opening at first end thereof and a second end opposite the first end. The second end has a plurality of holes. Each of the plurality of holes is adapted to receive a respective one of a plurality of pins therein. Each of the plurality of holes is further adapted to align the respective one of the plurality of pins when received therein when the respective one of the plurality of pins is not aligned.