Thin film magnetic head with improved thermal dissipation

摘要

The lower shield layer 22 is formed in a first recess in an under layer 21. A first metal layer 60 is formed in a second recess in the under layer and is distanced from the rear end face of the lower shield layer in a height direction. The upper face of the lower shield layer 22a, the upper face of the under layer 21b and the upper face of the first metal layer form a same smoothed face, which can be done using CMP. The magnetoresistive element 24 is between the lower shield layer and the upper shield layer 27. A second metal layer (28) is provided in the rear region of the lower shield layer. This arrangement improves thermal dissipation reducing the temperature in the thin film head.