| 摘要 |
The present invention is generally directed to various methods of forming metal silicide regions on transistors based upon gate critical dimensions. In one illustrative embodiment, the method comprises forming a layer of refractory metal above a plurality of transistors, reducing a thickness of at least a portion of the layer of refractory metal above at least some of the transistors and performing at least one anneal process to form metal silicide regions above the transistors. In another illustrative embodiment, the method comprises forming a layer of refractory metal above the plurality of transistors, reducing the thickness of the layer of refractory metal above a first of the transistors having a gate electrode with a critical dimension that is less than a critical dimension of a gate electrode structure of another of the plurality of transistors, and performing at least one anneal process to form metal silicide regions on the plurality of transistors. In yet another illustrative embodiment, the method comprises forming a layer of refractory metal to an original thickness above a plurality of transistors, reducing the original thickness of a portion of the layer of refractory metal above at least some of the transistors to define a layer of refractory metal having multiple thicknesses, and performing at least one anneal process to convert portions of the layer of refractory metal having multiple thicknesses to metal silicide regions on the transistors.
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