发明名称 |
FERROELECTRIC MEMORY DEVICE HAVING EXPANDED PLATE ELECTRODE FOR EASY ELECTRICAL CONTACT AND FABRICATING METHOD THEREOF |
摘要 |
PURPOSE: A ferroelectric memory device having an expanded plate electrode and a fabricating method thereof are provided to form a reliable contact structure between a plate line and a top electrode by connecting directly one plate line to top electrodes of ferroelectric capacitors between two adjacent rows within a cell array region. CONSTITUTION: A bottom interlayer dielectric(64,68) is formed on a semiconductor substrate(50). A plurality of ferroelectric capacitors(80) are arranged in columns and rows on the bottom interlayer dielectric. A top interlayer dielectric(84,88) having via holes is laminated on the entire surface of the semiconductor substrate including the ferroelectric capacitors. A plurality of plate electrodes(PL) are formed within the top interlayer dielectric. The plate electrodes are tangent to upper parts of the ferroelectric capacitors through the via holes.
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申请公布号 |
KR20040077267(A) |
申请公布日期 |
2004.09.04 |
申请号 |
KR20030012765 |
申请日期 |
2003.02.28 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JANG, NAK WON;KANG, HYEON YEOL;SONG, YUN JONG |
分类号 |
H01L27/04;G11C11/22;H01L21/8246;H01L27/115;H01L31/109;(IPC1-7):H01L27/04 |
主分类号 |
H01L27/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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