| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet in which a void is not formed in the case of attaching a chip and the sheet and which has high reliability, and a semiconductor device using the sheet. SOLUTION: In the adhesive sheet for bonding the chip and a supporting member or the mutual chips, (1) tack strength β at 25°C by measurement by a probe having a diameter of 5.1 mm on one surface (a surface b) is 0.05 to 5 N/the diameter of 5.1 mm, and the tack strength α at 25°C on the other surface (the surface a) is 0 to 1 N/the diameter of 5.1 mm and β-α≥0.05 N/the diameter of 5.1 mm, (2) the residual quantity of a solvent in the vicinity of one surface (the surface b) is 0.1 to 3 wt.%, and the residual quantity of the solvent in the vinicity of the other surface (the surface a) is γ×0.9 wt.% or less and (3) irregularities of the height of one surface (the surface b) are 100 nm or less, and irregularities of the other surface (the surface a) are 120 nm or more. COPYRIGHT: (C)2004,JPO&NCIPI |
