发明名称 METHOD OF FORMING WIRING, WIRING FOR ORGANIC ACTIVE ELEMENT, ORGANIC ACTIVE DEVICE, AND ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a method of forming wiring by which wiring is connected satisfactorily to an organic active element by preventing the deterioration of the element and the service life of the element from becoming shorter, and also to provide wiring for organic active element formed by the method, an organic active device, and electronic equipment. SOLUTION: The organic active element 11 is provided with a first substrate 10 on which the element 11 is formed, a second substrate 12 disposed to face the surface of the substrate 10 on which the element 11 is formed, and a holding member 13 which holds a space containing at least the element 11 and formed between the first and second substrates 10 and 12 in a tightly closed state. The element 11 is also provided with wiring 14 formed on the first substrate 10 to electrically connect the element 11 to external terminals 18 provided on the outside of the space 16. The wiring 14 is provided with organic wiring 14b composed of an organic material, and inorganic wiring 14a composed of an inorganic material. The organic wiring 14b is conductively connected to the element 11 in the space 16, and the inorganic wiring 14a is conductively connected to the external terminals 18. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004247344(A) 申请公布日期 2004.09.02
申请号 JP20030032559 申请日期 2003.02.10
申请人 SEIKO EPSON CORP 发明人 SATO TAKASHI
分类号 H01L21/3205;H01L23/52;H01L27/10;H01L29/06;H01L29/66;H01L51/00;H01L51/05;H01L51/40;(IPC1-7):H01L21/320 主分类号 H01L21/3205
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