发明名称 |
NON-COOLED OPTICAL COMMUNICATION MODULE |
摘要 |
PROBLEM TO BE SOLVED: To provide an optical communication module which can efficiently respond to a change in ambient temperature and reduce the volume and manufacturing cost of the overall optical communication module. SOLUTION: The non-cooled optical communication module comprises a flat thermistor having a positive temperature coefficient which increases the resistance with the increase of temperatures, a semiconductor chip 350 disposed on the upper surface of the thermistor 320, and a driving means for applying a predetermined voltage to the thermistor. COPYRIGHT: (C)2004,JPO&NCIPI
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申请公布号 |
JP2004247729(A) |
申请公布日期 |
2004.09.02 |
申请号 |
JP20040032972 |
申请日期 |
2004.02.10 |
申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
KANG BYUNG-KWON;CHO SHI-YUN;AHN JUNE-HYEON;LEE SHOEN |
分类号 |
H01S5/022;G02B6/42;H01S3/04;H01S5/02;H01S5/024;H01S5/042;H01S5/068;(IPC1-7):H01S5/022 |
主分类号 |
H01S5/022 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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