发明名称 NON-COOLED OPTICAL COMMUNICATION MODULE
摘要 PROBLEM TO BE SOLVED: To provide an optical communication module which can efficiently respond to a change in ambient temperature and reduce the volume and manufacturing cost of the overall optical communication module. SOLUTION: The non-cooled optical communication module comprises a flat thermistor having a positive temperature coefficient which increases the resistance with the increase of temperatures, a semiconductor chip 350 disposed on the upper surface of the thermistor 320, and a driving means for applying a predetermined voltage to the thermistor. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004247729(A) 申请公布日期 2004.09.02
申请号 JP20040032972 申请日期 2004.02.10
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 KANG BYUNG-KWON;CHO SHI-YUN;AHN JUNE-HYEON;LEE SHOEN
分类号 H01S5/022;G02B6/42;H01S3/04;H01S5/02;H01S5/024;H01S5/042;H01S5/068;(IPC1-7):H01S5/022 主分类号 H01S5/022
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