COOLING ASSEMBLY COMPRISING MICRO-JETS

摘要

The present invention relates to a cooling assembly (100) for cooling a heat source (2), in particular electronic components 7, with a coolant (C). To achieve a high coolant efficiency enabling the cooling of high heat fluxes, and in order to avoid the occurrence of free circulation areas in the cooling channel, but obtaining a microscopic transport of cooling through the cooling channel, a cooling assembly is proposed according to the present invention comprising: a plurality of micro jets (1) adapted to eject the coolant (C) onto the heat source (2) in response to a control signal, and a controller (15) adapted to control the ejection of the coolant (C) from the micro jets (1) in a sweep mode in which the micro jets (1) eject the coolant (C) subsequently. Preferably, the micro jets are arranged forming an array and are forced by forcing means (13, 14) to induce velocity perturbations of the coolant.