| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an array printed circuit board having a symmetrical layout structure, free from exchanging a facility having surface-mount equipment when surface-mount processing is carried out on an upper face and a lower face. <P>SOLUTION: This circuit board is an array printed circuit board having an upper face and a lower face, and on which a plurality of chip-adhering areas are located on the upper face and the lower face, respectively. While a first chip-adhering area and a second chip-adhering area are alternately located on the upper face to be mutually symmetric, and the second chip-adhering area and the first chip-adhering area are located alternately on the lower face to be mutually symmetric, the second chip-adhering area is located on the lower face corresponding to the upper face where the first chip-adhering area is located, and the first chip-adhering area is located on the lower face corresponding to the upper face where the second chip-adhering area is located. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
