发明名称 METHOD OF MANUFACTURING CONDUCTIVE CIRCUIT
摘要 PROBLEM TO BE SOLVED: To provide a method of easily manufacturing a conductive circuit which does not need to make plates and can respond to a small amount/a variety of orders on demand as well as mass production, and additionally whose size, shape or the like can be freely changed while having superior conductivity. SOLUTION: After conductive circuit forming patterns 3 are formed on prescribed parts of the surface of a substrate 1 using a metal colloid-containing inkjet ink, they are heated and dried to manufacture the conductive circuit. It is preferable to use the inkjet ink containing such a prescribed amount of metal colloid that the surface resistance of the conductive circuit after heating and drying becomes 1/10,000 to 1/50,000 times the surface resistance before heating and drying. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004247667(A) 申请公布日期 2004.09.02
申请号 JP20030038203 申请日期 2003.02.17
申请人 TOPPAN FORMS CO LTD 发明人 ENDO YASUHIRO;HIRASAWA AKIRA;KAWAZOME MITSURU;TAKAHASHI HIRONARI
分类号 B41J2/01;H05K3/10;(IPC1-7):H05K3/10 主分类号 B41J2/01
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