| 摘要 |
PROBLEM TO BE SOLVED: To provide a plasma treatment method with which a highly reliable fine pattern can be formed by removing a reactive deposition that is stuck within a vacuum container and may become a dust source. SOLUTION: In the plasma treatment method, a gas is exhausted while being fed into the vacuum container and a high frequency power is applied to a plasma source that is provided while facing a substrate electrode for placing a substrate thereon within the vacuum container, while controlling the inside of the vacuum container into a predetermined pressure, so that a plasma is generated within the vacuum container and a noble metal or a material containing a noble metal on the substrate is etched. After the end of the etching process, the inside of the vacuum container is cleaned by using an ammonia gas different from the etching process. COPYRIGHT: (C)2004,JPO&NCIPI
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