| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer appearance inspection device capable of reducing detection of noncritical defects, and shortening the time required for visual confirmation. SOLUTION: This wafer appearance inspection device has a light source 106 for irradiating the wafer 104 surface with light, a CCD camera 102 which is a detector for detecting reflected light from the wafer irradiated by the light source 106, an XY stage 101 on which the wafer is placed, and a control part for determining to be a defect when the density difference detected by the CCD camera 102 from the same point on a comparison chip 108 as an inspection chip 107 on the wafer 104 by moving the XY stage 101 is over a prescribed threshold. A filter wherein the difference between the brightness detected from a pattern normal part and the brightness detected from a noncritical defect becomes the smallest compared with the case where the filter is not used is selected among a plurality of wavelength selection filters 109 having different wavelength selection ranges, and inserted into an optical path. COPYRIGHT: (C)2004,JPO&NCIPI
|
