| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit board by which an insulating passivation film formed with an opening to expose a bump electrode can be formed relatively easily and at low cost. <P>SOLUTION: First, a substrate 10 formed with the bump electrode 12 and an interconnection 13 is prepared. Next, an insulating resin film is laminated on the substrate 10 to form the insulating passivation film 15. Then, the substrate 10 is hot-pressed between two flat plates, thereby making the insulating passivation film 15 thin on the bump electrode 12 and thick on the other portions. Thereafter, the insulating passivation film 15 is dry-etched to form the opening to expose the bump electrode 12. The interconnection 13 is covered and protected by a remaining part of the insulating passivation film 15. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
