| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for molding both surfaces of a printed circuit board module. <P>SOLUTION: Upper and lower molds 111, 113 are prepared. The upper mold 111 includes an upper cavity 117 filled with an epoxy compound and an upper gate 119 functioning as an injection passage. The lower mold 113 is arranged under the upper mold 111 and includes a lower cavity 121 and a lower gate 123. A module mounting a wafer level package having a bump is placed between the upper and lower molds 111 and 113. The epoxy mold compound is injected (allowed to flow) through an injection section 125 adjacent to the lower gate 123 and an upper gate 119, thus filling the epoxy compound into the lower and upper cavities 121, 117 to complete double-sided molding. In this manner, the upper and lower surfaces of the printed circuit board are molded at the same time, thus improving the productivity. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
